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Keynote Speakers
Jun Chen
Shanghai Jiao Tong University (China)
Conference Sponsors and Organizers
This conference is sponsored by the
Materials Processing & Manufacturing Division and the
Shaping and Forming Committee, and is being organized by the following individuals:
| Lead Organizer |
Glenn Daehn, The Ohio State University, USA |
| |
| Local Organizing Committee |
Libby Culley, The Ohio State University, USA
Glenn Daehn, The Ohio State University, USA
Anupam Vivek, The Ohio State University, USA
|
| |
| ICTP 2021 Advisory Committee |
Jian Cao, Northwestern University, USA
Glenn Daehn, The Ohio State University, USA
Brad Kinsey, University of New Hampshire, USA
Erman Tekkaya, Technical University of Dortmund, Germany
Yoshinori Yoshida, Gifu University, Japan
|
For More Information
For more information about this meeting, please complete the meeting inquiry form or contact:
TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770