Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 25-30, 2021 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

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Register by June 11, 2021 for discounted rates.

From fundamental science to industrial application, the breadth of the metal forming community will convene at The 13th International Conference on the Technology of Plasticity (ICTP 2021). Scientists and engineers from across industry, academia, and government will share their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups.

Note: The 13th International Conference on the Technology of Plasticity was originally planned for July 2020 and is now set for July 2021.

Monitoring COVID-19: The health and safety of meeting participants is the top priority of the ICTP organizing committee and TMS. Please be assured that the organizers are committed to finding a safe pathway to deliver the symposia that have been organized. However, due to the volatility of the circumstances imposed on us due to the COVID-19 pandemic, we may not know exactly what that will look like until closer to the meeting. Please check this website regularly for updates and watch your e-mail for communications from TMS on this matter.

Thank You to Our Sponsors

IMPORTANT DATES

Abstract Submission Deadline Extension:
November 15, 2020

Manuscript Deadline:
December 11, 2020

Discount Registration Deadline:
June 11, 2021

Housing Deadline:
July 2, 2021

Conference Dates:
July 25-30, 2021

RESOURCES
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Keynote Speakers

Irene Beyerlein
University of California, Santa Barbara (USA)
Pierre-Olivier Bouchard
Mines ParisTech (France)
Oana Cazacu
University of Florida-REEF (USA)
Jun Chen
Shanghai Jiao Tong University (China)
Matthias Kleiner
Leibniz Association (Germany)
Takashi Kuboki
University of Electro-Communications (Japan)
Reimund Neugebauer
Fraunhofer-Gesellschaft (Germany)
Christopher Schuh
Massachusetts Institute of Technology (USA)

Conference Sponsors and Organizers

This conference is sponsored by the Materials Processing & Manufacturing Division and the Shaping and Forming Committee, and is being organized by the following individuals:
Lead Organizer Glenn Daehn, The Ohio State University, USA
 
Local Organizing Committee Libby Culley, The Ohio State University, USA
Glenn Daehn, The Ohio State University, USA
Anupam Vivek, The Ohio State University, USA
 
ICTP 2021 Advisory Committee Jian Cao, Northwestern University, USA
Glenn Daehn, The Ohio State University, USA
Brad Kinsey, University of New Hampshire, USA
Erman Tekkaya, Technical University of Dortmund, Germany
Yoshinori Yoshida, Gifu University, Japan

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770