Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 26-31, 2020 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

From fundamental science to industrial application, the breadth of the metal forming community will convene at The 13th International Conference on the Technology of Plasticity (ICTP 2020). Scientists and engineers from across industry, academia, and government will share their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups.

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Who Will Benefit

Students, postdocs, government and industry research leaders, and academics from across the globe currently studying or applying the science and engineering principles of metal forming and shaping.

Conference Sponsors and Organizers

This conference is sponsored by the Materials Processing & Manufacturing Division and the Shaping and Forming Committee, and is being organized by the following individuals:
Lead Organizer Glenn Daehn, The Ohio State University, USA
 
Local Organizing Committee Elizabeth D. Culley, The Ohio State University, USA
Glenn Daehn, The Ohio State University, USA
Anupam Vivek, The Ohio State University, USA
 
ICTP Advisory Committee Jian Cao, Northwestern University, USA
Glenn Daehn, The Ohio State University, USA
Brad Kinsey, University of New Hampshire, USA
Erman Tekkaya, Technical University of Dortmund

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For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770