Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 25-30, 2021 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

Submit an Abstract
Abstract Submission Deadline: September 1, 2020

From fundamental science to industrial application, the breadth of the metal forming community will convene at The 13th International Conference on the Technology of Plasticity (ICTP 2021). Scientists and engineers from across industry, academia, and government will share their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups.

Note: The 13th International Conference on the Technology of Plasticity was originally planned for July 2020 and is now set for July 2021. A call for abstracts has reopened for the 2021 event.

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Keynote Speakers

Irene Beyerlein
University of California, Santa Barbara (USA)
Pierre-Olivier Bouchard
Mines ParisTech (France)
Oana Cazacu
University of Florida-REEF (USA)
Jun Chen
Shanghai Jiao Tong University (China)
Matthias Kleiner
Leibniz Association (Germany)
Takashi Kuboki
University of Electro-Communications (Japan)
Reimund Neugebauer
Fraunhofer-Gesellschaft (Germany)
Christopher Schuh
Massachusetts Institute of Technology (USA)

Conference Sponsors and Organizers

This conference is sponsored by the Materials Processing & Manufacturing Division and the Shaping and Forming Committee, and is being organized by the following individuals:
Lead Organizer Glenn Daehn, The Ohio State University, USA
 
Local Organizing Committee Libby Culley, The Ohio State University, USA
Glenn Daehn, The Ohio State University, USA
Anupam Vivek, The Ohio State University, USA
 
ICTP 2021 Advisory Committee Jian Cao, Northwestern University, USA
Glenn Daehn, The Ohio State University, USA
Brad Kinsey, University of New Hampshire, USA
Erman Tekkaya, Technical University of Dortmund, Germany
Yoshinori Yoshida, Gifu University, Japan

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

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