Topic Title: Functional Materials for Printed, Flexible, and Wearable Electronics
Manuscript Submission Deadline:
April 01, 2018
Sponsored By: Thin Films and Interfaces Committee
Publication Date: September 2018
Keywords: Electronic Materials, Thin Films and Interfaces
Scope: "This special topic is devoted to the emerging manufacturing concepts and techniques for the processing of 2D/3D structures and integration of functional electronic components and devices on engineered geometries. Advances in energy harvesting and storage devices are essential to drive low-cost, low-power sensors and implement multifunctional sensor systems. Functional materials, low-temperature processing, large area manufacturing, and electronic
applications are within the scope of this topic. Invited and contributed papers will discuss both the fundamental aspects underlying certain applications and the particular challenges regarding technology, fabrication processes, and reliability."