Meeting Resources
6th World Congress on Integrated Computational Materials Engineering (ICME 2021)

November 14–18, 2021

Hyatt Regency Lake Tahoe, ­Lake Tahoe, Nevada, USA

Submit Abstract
Abstract Submission Extended Deadline: April 30, 2021

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Register by October 1 for the best rate.

The 6th World Congress on Integrated Computational Materials Engineering (ICME 2021) convenes leading researchers and practitioners to share the latest knowledge and advances in the discipline. This congress is the recognized hub of interaction among software developers and process engineers along the entire production chain, as well as for materials scientists and engineers developing new materials.

This is the only congress dedicated to bringing all stakeholders together from across nations, disciplines, and organizations to focus on integration priorities and gaps that need to be addressed in order to advance the field.

ICME 2021 will benefit researchers, software developers, metallurgists, materials scientists and engineers, process engineers, senior scientists, chief technology officers, and a variety of others working in R&D. Attendees will gain insights on recent advances and discuss opportunities to overcome challenges in the field.

Due to the pandemic, ICME 2021 was rescheduled from April to November. A call for abstracts has reopened for the event. Please note that if your work was accepted for the April program, it will automatically be included in the November program. You do not need to submit your abstract again.

Thank You to Our Sponsors

IMPORTANT DATES

Abstract Submission Extended Deadline:
April 30, 2021

Discount Registration Deadline:
October 1, 2021

Housing Deadline:
October 22, 2021

Congress Dates:
November 14–18, 2021

Journal Submission Deadline:
January 7, 2022

RESOURCES
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Congress Sponsors and Organizers

This congress is sponsored by TMS Materials Processing & Manufacturing Division (MPMD) and the Integrated Computational Materials Engineering (ICME) Committee, and is being organized by the following individuals:
Chair Will Joost
Programming Chair Danielle Cote, Worcester Polytechnic Institute, USA
Members Kester Clarke, Colorado School of Mines, USA
Javier Llorca, Technical University of Madrid and IMDEA Materials Institute, Spain
Heather Murdoch, Army Research Laboratory, USA
Satyam S. Sahay, John Deere Technology Center, India
Mike Sangid, Purdue University, USA 

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
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Other Countries: 1-724-776-9000
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