Meeting Resources
International Congress on 3D Materials Science (3DMS 2021)

June 26–29, 2022

Hyatt Regency Washington on Capitol Hill • Washington, D.C., USA

Technical Program

Registration is now closed.

This meeting took place June 26–29, 2022. Please join the e-mail list to receive updates about 3DMS and future meetings.

The 6th International Congress on 3D Materials Science seeks to provide the premier forum for presentations of current interest and significance to the three-dimensional characterization, visualization, quantitative analysis, modeling, and development of structure–property relationships of materials, as well as big data and machine learning issues associated with 3D materials science. Additionally, this congress will provide an intimate environment for rich discussions and interactions among the key researchers in the world to not only assess the state-of-the-art within the various elements of 3D materials science, but also to roadmap the key areas of future research.

Thank You to Our Sponsors

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Abstract Submission Extended Deadline:
March 4, 2022

Discount Registration Deadline:
May 13, 2022

Housing Extended Deadline:
June 8, 2022

Congress Dates:
June 26–29, 2022

Journal Submission Deadline:
August 31, 2022


Plenary Speakers

Henning Friis Poulsen
The 3D Imaging Centre, Technical University of Denmark
Presentation Title: "Dark Field X-ray Microscopy"
Reeju Pokharel
Los Alamos National Laboratory
Presentation Title: "Towards Machine Learning-assisted Real-time Feedback and Guided Experiments"
Michael Uchic
Air Force Research Laboratory, Materials and Manufacturing Directorate
Presentation Title: "A Perspective on Serial Sectioning System Technology for Structural Materials Characterization"

Learn more about the technical program.

Health and Safety

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Congress Sponsors and Organizers

This congress is sponsored by the TMS Structural Materials Division (SMD) and the Advanced Characterization, Testing, and Simulation Committee, and is being organized by the following committee of individuals:

Organizing Committee

  • Dorte Juul Jensen, Technical University of Denmark, Denmark (Chair)
  • Marie Charpagne, University of Illinois, USA
  • Keith Knipling, Naval Research Laboratory, USA
  • Klaus-Dieter Liss, Guangdong Technion - Israel Institute of Technology, China
  • Matthew P. Miller, Cornell University, USA
  • David J. Rowenhorst, U.S. Naval Research Laboratory, USA

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000, ext. 241
Fax: 1-724-776-3770