FMD Gilbert Chin Scholarship

One $2,500 scholarship is available to an undergraduate student in their sophomore or junior year, who is studying subjects in relation to synthesis and processing, structure, properties, and performance of electronic, photonic, magnetic, and superconducting materials as well as materials used in packaging, and interconnecting such materials in device structures.

The award's namesake, Gilbert Chin, was born in Kwangtung, China. He was a physical metallurgist and made significant contributions to our understanding and applications of crystal plasticity and to the development of magnetic alloys for telecommunications. He was director of the Passive Components Research Laboratory at AT&T Bell Laboratories doing significant research and development in the areas of optical fibers, electronic ceramics, and materials for high-temperature superconductivity. He died on May 5, 1991 at the age of fifty-six. At the time of his death, he was the holder of eleven patents and author or coauthor of more than 140 publications. Among his many awards and honors, he was elected a Fellow of the Metallurgical Society of AIME - class of 1981.

An additional $500 for travel expenses is available to the recipient in order to personally accept the award at the TMS Annual Meeting and Exhibition. The scholarship recipient is known as the FMD Gilbert Chin Scholar. Award recipients must travel to and attend the conference in order to receive the travel funds associated with this award.

Funding for this scholarship is provided by the TMS Functional Materials Division.

Funds for the Battelle Materials Graduate Student Award will soon be exhausted and will be issued on a first-come/first-served basis.

Criteria

1. The applicant must be a student member of Material Advantage.
2. Applicants must be a current undergraduate sophomore or junior enrolled full time in a metallurgical/materials science engineering program at a qualified college or university.
3. Relatives of members of the funding committee/division are not eligible.
4. Submitted coursework must be relevant to the scholarship for which the student is applying.
5. Grade Point Average (GPA) of 3.0 or higher required.

How to Apply

Submission Deadline:
March 15 of each year

Please submit online the following documents to complete the scholarship application process. Paper and e-mailed applications and letters will not be accepted.

1. Completed application form.
2. An individual statement describing unique educational experiences (e.g., special projects), career plans, leadership experience, involvement in a Material Advantage chapter, and community involvement. This statement should be no more than 200 words and double-spaced.
3. Curriculum Vitae or Resume.
4. An up-to-date transcript of your academic record.
5. Three (3) recommendations from educators and/or employees who are familiar with your background.

You may apply for up to two TMS sponsored scholarships per year, however, TMS will only award one scholarship per student per year. If you are selected for more than one scholarship, you will automatically receive the one with the highest value.