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JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

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This topic is no longer accepting submissions.

Guest Editor: Shih-Kang Lin

Sponsored By: Alloy Phases

Publication Date: September 2019

Keywords: Advanced processing, alloy phases, electronic materials, joining, phase transformations

Scope: Papers are invited for this special topic covering recent advances of bonding technologies for 2.5D and 3D IC, wide-band-gap (WBG) semiconductors, and flexible electronics.

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JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

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