JOM Editorial Calendar - Topic Details

Advances in Electronic Interconnection Materials

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Sponsored By: Electronic Packaging and Interconnection Materials

Publication Date: January 2019

Keywords: Electronic Materials,Intermetallics,Lead, Zinc, and Tin

Scope: This topic will include papers on Pb-free solder development, advances in the understanding of joint reliability and emerging interconnection materials for harsh environments.

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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JOM Editorial Calendar - Topic Details

Advances in Electronic Interconnection Materials

How to Submit a Manuscript

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