Advanced Technology for Electronic Packaging and Interconnection Materials
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Manuscript Submission Deadline:
December 01, 2022
Publication Date: June 2023
Keywords: Advanced Materials, Electronic Materials, Intermetallics, Joining, Thin Films and Interfaces
Scope: Advanced progress in devices requires new materials and technologies to meet the electrical, thermal, mechanical, reliability and environmental demands. The special topic will address current research in new and existing materials for emerging interconnects and electronic packaging.
Call for Papers:
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